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010-64442309
address：Room 215, North Anhua Building, No. 8 Yinghua West Street, Chaoyang District, Beijing
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Easy to rework one-component thermal gel BH-T1110/1120
Easy-to-rework thermally conductive gel is a one-component room temperature curing thermally conductive material. It is cured in the presence of moisture to produce durable, relatively low-stress elastomers and non-corrosive by-products. The product does not need to be mixed when used, and is applied by dispensing. It can achieve a very small interface thickness (<50µm) under very low pressure, providing excellent thermal conductivity and low thermal resistance, and maintaining good long-term reliability. The cured product can be easily peeled off the substrate during rework.
constitute
Ÿ Polymer
Ÿ Ceramic filler
性能 | 单位 | 1110 | 1120 | 测试方法 | |
颜色 | / | 白色 | 浅红色 | 目测 | |
点胶速率, 30毫升针筒, 90psi | g/min | 25 | 25 | / | |
密度 | g/cm3 | 2.5 | 2.8 | ASTM D792 | |
低分子量硅氧烷含量(D4-D20) | ppm | 0 | 0 | GC-MS | |
典型的最小界面厚度 | mm | 0.05 | 0.1 | / | |
导热系数 | W/m·K | 1.5 | 2.0 | ASTM D5470 | |
23°C/50%RH表面硬化时间 | min | 15 | 20 | ASTM C679 | |
24小时硬化深度 (at 23°C, 50%RH) | mm | 3 | 3 | / | |
固化后硬度, Shore A | / | 50 | 60 | ASTM D2240 | |
固化后拉伸强度 | MPa | 3.0 | 3.0 | ASTM D412 | |
固化后拉断伸长率 | % | 100 | 50 | ASTM D412 | |
PCB基板上返工, 徒手剥离实验 | / | 易剥离 | 易剥离 | / | |
工作温度范围 | ℃ | -55~110 | -55~110 | / | |
绝缘强度 | VAC/mm | >6000 | >6000 | ASTM D149 | |
体积电阻率 | Ω·cm | >1013 | >1013 | ASTM D257 | |
UL94阻燃等级 | / | V-0 | V-0 | UL 94 | |
RoHS标准 | / | 符合 | 符合 | / | |
除气测试 | TML | % | <0.5 | <0.5 | ASTM E595 |
CVCM | % | <0.1 | <0.1 | ||
保存期 | 月 | 6 | 6 | / | |
易返工单组份导热凝胶的包装和订购信息
BH-TXXXX-YY-ZZZZ | |||
BH-T | XXXX- | YY- | ZZZZ |
产品编码 1110 1120 | 00：胶筒 11：桶装 | 0060：30CC点胶筒包装，60克 0120：55CC点胶筒包装，120克 0360：180CC点胶筒包装，360克 0600：300CC点胶筒包装，600克 其它的客户指定包装 | |