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Non-silicon one-component thermal conductive gel BH-T1930N
1930N is a fully cured silicone-free thermal conductive gel. This pre-cured material has no silicone contamination or pumping, is compatible with soldering chemicals, and does not affect the repainting performance of the component surface. There is no need to mix or solidify during use, and glue is applied by dispensing. 1930N provides excellent thermal conductivity and low thermal resistance, and can achieve high compressibility under very low pressure, thereby reducing stress on the device.
constitute
Ÿ Poly alpha olefin
Ÿ Ceramic filler
性能 | 单位 | 1930N | 测试方法 | |
颜色 | / | 灰色 | 目测 | |
点胶速率, 30毫升针筒, 90psi | g/min | 15 | / | |
密度 | g/cm3 | 3.1 | ASTM D792 | |
低分子量硅氧烷含量(D4-D20) | ppm | 0 | GC-MS | |
典型的最小界面厚度 | mm | 0.1 | / | |
导热系数 | W/m·K | 3 | ASTM D5470 | |
热膨胀系数 | ppm/K | 200 | ASTM E831 | |
工作温度范围 | ℃ | -55~150 | / | |
绝缘强度 | VAC/mm | >6000 | ASTM D149 | |
体积电阻率 | Ω·cm | >1013 | ASTM D257 | |
介电常数, 1MHz | / | 6.0 | ASTM D150 | |
UL94阻燃等级 | / | V-0 | UL 94 | |
RoHS标准 | / | 符合 | / | |
除气测试 | TML 总的质量损失 | % | <0.5 | ASTM E595 |
CVCM 挥发物质冷凝量 | % | <0.1 | ||
保存期 | 月 | 12 | / | |
Packaging and ordering information for one-component non-silicon thermal conductive gel
BH-TXXXXX-YY-ZZZZ | |||
BH-T | XXXXX- | YY- | ZZZZ |
产品编码 1930N | 00：胶筒 11：桶装 | 0080：30CC点胶筒包装，80克 0150：55CC点胶筒包装，150克 0480：180CC点胶筒包装，480克 0800：300CC点胶筒包装，800克 0005：5L桶装，5KG 其它的客户指定包装 | |