One-component thermal gel

The one-component thermal gel product is composed of silicone polymer and high thermal conductivity ceramic filler, without any metal filler, thermal conductivity of up to 6W/m·K, single-component packaging, no mixing or curing is required during use. Glue is applied by dispensing. The one-component thermal gel provides excellent thermal conductivity and low thermal resistance, and can achieve high compressibility under very low pressure, thereby reducing the stress on the device.

Product Features

Ÿ Ultra-low thermal resistance of thermal conductive gel, optimize the heat dissipation performance of the product, and low compressive stress on the device

Ÿ Better wettability, the same wetting effect as thermal pads can be achieved under smaller compression deformation

Ÿ Adapt to chips of different heights, without special consideration of product size and tolerance restrictions, flexible R&D and design

Ÿ Material coding is unified, which improves the convenience of purchasing management. One model specification can realize the requirements of multiple models and multiple products. High degree of automation, which greatly improves construction efficiency, reduces labor and time costs, and optimizes products Stability

Application field

Ÿ Microprocessor cooling

Ÿ Memory and power module

Ÿ Power Electronics

Ÿ Automotive Electronics

Ÿ Semiconductor

Ÿ Flat Panel Display

Ÿ Consumer Electronics

Packaging of one-component thermal gel

Ÿ 30CC dispensing cartridge (80g)

Ÿ 55CC dispensing cartridge (150g)

Ÿ 180CC dispensing cartridge (480g)

Ÿ 300CC dispensing cartridge (800g)

Ÿ 5L drum (5 kg)

Ÿ Customized packaging