One-component room temperature curing conductive glue BH-E1321/6722

product description

BH-E1321/6722 is a high-conductivity silicone rubber that cures quickly at room temperature, which effectively simplifies the problem of conductive bonding between silicone EMI gaskets and metal substrates. It reacts with moisture in the air at room temperature to cure into a high-performance elastomer with low shrinkage during curing, fast curing speed, good electrical conductivity, no volatile organic compounds (VOCs), and environmentally friendly. The cured silicone rubber has excellent physical and electrical properties.

constitute

Ÿ Silicone rubber

Ÿ Silver-plated copper powder/nickel-plated graphite powder

Product Features

Ÿ Single component, easy to use, suitable for assembly line operation

Ÿ Excellent electrical conductivity

Ÿ Elastomer, with good resistance to impact and deformation

Ÿ Good adhesion

Ÿ UV and high temperature resistance

Application field

Ÿ Used for bonding inductance conductors and other conductors

Ÿ Conductive EMI gaskets for consumer electronics

Ÿ EMI plastic products

Ÿ Metal casting products

Ÿ Conductive connectors and packaging

Ÿ Conductive sealing and impregnation

Performance

Instructions:

1. Substrate preparation:

All surfaces must be clean and dry, degreasing, and wash away all contaminants that may affect adhesion. Suitable cleaning solvents include: isopropanol, acetone and methyl ethyl ketone. On many substrates, such as glass, metal and most engineering plastics, it can be bonded without primer, but it is usually not good for bonding materials, such as PTFE, polyethylene, polypropylene, PET and others Similar materials need to be primed. If you want to achieve the best bonding effect, it is recommended to use a primer. After solvent cleaning, apply a thin layer of primer by dipping, brushing or spraying. Let the primer dry at room temperature and relative humidity ≥50% for 15 to 60 minutes. In order to achieve a better bonding effect, it is best to use the relevant primer product BH-T1190 of Beijing Beihua New Rubber Special Material Technology Co., Ltd.:

(1) Clean the surface with solvents such as isopropanol or polish the surface of the material with sandpaper or burlap until the surface is rough;

(2) Apply a thin layer of primer to the surface of the substrate by spraying, brushing or dipping, and allow the primer to dry for at least 15 to 60 minutes under 50% relative humidity.

2. Curing process and time:

(1) The colloid will solidify when exposed to moisture in the air, and the colloid will be skinned for a certain period of time (10-30 minutes).

(2) The colloid gradually solidifies from the surface to the inside. The curing depth of the gel for 24 hours at 25°C and 50% relative humidity is 2-3mm. Very deep parts, especially places that are not easily exposed to moisture, take longer to cure completely. When the humidity is low, the curing time will be correspondingly extended. Before using or packaging the bonded parts, it is best to ensure sufficient time to fully cure the bonded part.

3. Storage and validity period:

Ÿ Store at low temperature, the shelf life of unopened original packaging products at -5℃-10℃ is 6 months.

Ÿ The remaining product after opening must be tightly sealed and stored when not in use. When it is used again, a cured product may form on the top of the storage container. This cured product can be easily removed without affecting the quality of the remaining product and can be used continuously.

Packing specifications and ordering information

    Quality Assurance

盐雾腐蚀测试——GJB 150.11A-2009