Thermal silica

With the development of industrial production and science and technology, people continue to put forward new requirements for materials. In the field of electronics and electrical appliances, due to the rapid development of integration technology and assembly technology, electronic components and logic circuits are becoming lighter, thinner, and smaller, and the amount of heat is also increased. Therefore, high thermal conductivity insulating materials are required to effectively remove electronic equipment. The heat generated is related to the service life and quality reliability of the product. The traditional method to solve the heat dissipation of electronic equipment is to put a layer of insulating medium between the heating body and the heat sink as a heat-conducting material, such as mica, polytetrafluoroethylene, and beryllium oxide ceramics. This method has certain effects. But there are disadvantages such as poor thermal conductivity, low mechanical properties, and high price [1]. At present, some of the heat dissipation of electronic equipment is solved by various forms of heat sinks, but most of them must be solved by thermally conductive materials. Thermally conductive silicone rubber materials are the most important members of thermally conductive materials. The latest thermal silica gel developed by Beihua New Rubber Special Material Technology Co., Ltd. has made a major breakthrough. Currently, there are two types of thermal silica gels that are finalized and mass-produced. They are divided into general-purpose thermal silica gel and high thermal conductivity silica gel according to their performance: the thermal conductivity of general-purpose thermal silica gel is 1.5W/mK, thermal conductivity of high thermal conductivity type is 3.0W/mK.